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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
1M x 16 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY
FEATURES
* High-speed access times: 8, 10, 20 ns * High-performance, low-power CMOS process * Multiple center power and ground pins for greater noise immunity * Easy memory expansion with CE and OE options * CE power-down * Fully static operation: no clock or refresh required * TTL compatible inputs and outputs * Single power supply VDD 1.65V to 2.2V (IS61WV102416ALL) speed = 20ns for VDD 1.65V to 2.2V VDD 2.4V to 3.6V (IS61/64WV102416BLL) speed = 10ns for VDD 2.4V to 3.6V speed = 8ns for VDD 3.3V + 5% * Packages available: - 48-ball miniBGA (9mm x 11mm) - 48-pin TSOP (Type I) * Industrial and Automotive Temperature Support * Lead-free available * Data control for upper and lower bytes
ISSI
OCTOBER 2006
(R)
DESCRIPTION The ISSI IS61WV102416ALL/BLL and IS64WV102416BLL
are high-speed, 16M-bit static RAMs organized as 1024K words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory. A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The device is packaged in the JEDEC standard 48-pin TSOP Type I and 48-pin Mini BGA (9mm x 11mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1024K x 16 MEMORY ARRAY
VDD GND I/O0-I/O7 Lower Byte I/O8-I/O15 Upper Byte I/O DATA CIRCUIT
COLUMN I/O
CE OE WE UB LB CONTROL CIRCUIT
Copyright (c) 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. B 09/22/06
1
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
48-pin mini BGA (9mmx11mm)
1 2 3 4 5 6
ISSI
(R)
A B C D E F G H
LB I/O8 I/O9 GND VDD I/O14 I/O15 A18
OE UB I/O10 I/O11 I/O12 I/O13 A19 A8
A0 A3 A5 A17 NC A14 A12 A9
A1 A4 A6 A7 A16 A15 A13 A10
A2 CE I/O1 I/O3 I/O4 I/O5 WE A11
NC I/O0 I/O2 VDD GND I/O6 I/O7 NC
PIN DESCRIPTIONS
A0-A19 I/O0-I/O15 CE OE WE LB UB NC VDD GND Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground
2
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Rev. B 09/22/06
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
ISSI
(R)
48-pin TSOP-I (12mm x 20mm)
A4 A3 A2 A1 A0 NC CE I/O0 I/O1 I/O2 I/O3 VDD GND I/O4 I/O5 I/O6 I/O7 WE NC A19 A18 A17 A16 A15
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A5 A6 A7 A8 OE UB LB I/O15 I/O14 I/O13 I/O12 GND VDD I/O11 I/O10 I/O9 I/O8 NC A9 A10 A11 A12 A13 A14
PIN DESCRIPTIONS
A0-A19 I/O0-I/O15 CE OE WE LB UB NC VDD GND Address Inputs Data Inputs/Outputs Chip Enable Input Output Enable Input Write Enable Input Lower-byte Control (I/O0-I/O7) Upper-byte Control (I/O8-I/O15) No Connection Power Ground
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Rev. B 09/22/06
3
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
TRUTH TABLE
WE X H X H H H L L L CE H L L L L L L L L OE X H X L L L X X X LB X X H L H L L H L UB X X H H L L H L L I/O PIN I/O0-I/O7 I/O8-I/O15 High-Z High-Z High-Z DOUT High-Z DOUT DIN High-Z DIN High-Z High-Z High-Z High-Z DOUT DOUT High-Z DIN DIN
ISSI
VDD Current ISB1, ISB2 ICC ICC
(R)
Mode Not Selected Output Disabled Read
Write
ICC
ABSOLUTE MAXIMUM RATINGS(1)
Symbol VTERM VDD TSTG PT Parameter Terminal Voltage with Respect to GND VDD Relates to GND Storage Temperature Power Dissipation Value -0.5 to VDD + 0.5 -0.3 to 4.0 -65 to +150 1.0 Unit V V C W
Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE(1,2)
Symbol CIN CI/O Parameter Input Capacitance Input/Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 8 Unit pF pF
Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25C, f = 1 MHz, VDD = 3.3V.
4
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Rev. B 09/22/06
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
ISSI
VDD (20 nS) 1.65V-2.2V 1.65V-2.2V 1.65V-2.2V
(R)
OPERATING RANGE (VDD) (IS61WV102416ALL)
Range Ambient Temperature Commercial 0C to +70C Industrial -40C to +85C Automotive -40C to +125C
OPERATING RANGE (VDD) (IS61WV102416BLL)(1)
Range Ambient Temperature Commercial 0C to +70C Industrial -40C to +85C VDD (8 nS) 3.3V + 5% 3.3V + 5% VDD (10 nS) 2.4V-3.6V 2.4V-3.6V
Note: 1. When operated in the range of 2.4V-3.6V, the device meets 10ns. When operated in the range of 3.3V + 5%, the device meets 8ns.
OPERATING RANGE (VDD) (IS64WV102416BLL)
Range Automotive Ambient Temperature -40C to +125C VDD (10 nS) 2.4V-3.6V
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Rev. B 09/22/06
5
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
DC ELECTRICAL CHARACTERISTICS (Over Operating Range) VDD = 3.3V + 5%
Symbol VOH VOL VIH VIL ILI ILO Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage(1) Input Leakage Output Leakage GND VIN VDD GND VOUT VDD, Outputs Disabled Test Conditions VDD = Min., IOH = -4.0 mA VDD = Min., IOL = 8.0 mA Min. 2.4 -- 2 -0.3 -1 -1
ISSI
Max. -- 0.4 VDD + 0.3 0.8 1 1 Unit V V V V A A
(R)
Note: 1. VIL (min.) = -0.3V DC; VIL (min.) = -2.0V AC (pulse width - 2.0 ns). Not 100% tested. VIH (max.) = VDD + 0.3V DC; VIH (max.) = VDD + 2.0V AC (pulse width - 2.0 ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range) VDD = 2.4V-3.6V
Symbol VOH VOL VIH VIL ILI ILO Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage(1) Input Leakage Output Leakage GND VIN VDD GND VOUT VDD, Outputs Disabled Test Conditions VDD = Min., IOH = -1.0 mA VDD = Min., IOL = 1.0 mA Min. 1.8 -- 2.0 -0.3 -1 -1 Max. -- 0.4 VDD + 0.3 0.8 1 1 Unit V V V V A A
Note: 1. VIL (min.) = -0.3V DC; VIL (min.) = -2.0V AC (pulse width - 2.0 ns). Not 100% tested. VIH (max.) = VDD + 0.3V DC; VIH (max.) = VDD + 2.0V AC (pulse width - 2.0 ns). Not 100% tested.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range) VDD = 1.65V-2.2V
Symbol VOH VOL VIH VIL(1) ILI ILO Parameter Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Leakage Output Leakage GND VIN VDD GND VOUT VDD, Outputs Disabled Test Conditions IOH = -0.1 mA IOL = 0.1 mA VDD 1.65-2.2V 1.65-2.2V 1.65-2.2V 1.65-2.2V Min. 1.4 -- 1.4 -0.2 -1 -1 Max. -- 0.2 VDD + 0.2 0.4 1 1 Unit V V V V A A
Notes: 1. VIL (min.) = -0.3V DC; VIL (min.) = -2.0V AC (pulse width -2.0ns). Not 100% tested. VIH (max.) = VDD + 0.3V DC; VIH (max.) = VDD + 2.0V AC (pulse width -2.0ns). Not 100% tested.
6
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Rev. B 09/22/06
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
ISSI
Unit (2.4V-3.6V) 0.4V to VDD-0.3V 1.5ns VDD/2 See Figures 1 and 2 Unit (3.3V + 5%) 0.4V to VDD-0.3V 1.5ns VDD/2 + 0.05 See Figures 1 and 2 Unit (1.65V-2.2V) 0.4V to VDD-0.2V 1.5ns VDD/2 See Figures 1 and 2
(R)
AC TEST CONDITIONS (HIGH SPEED)
Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level (VRef) Output Load
AC TEST LOADS
319 3.3V
ZO = 50 OUTPUT
50 1.5V
OUTPUT
30 pF Including jig and scope
5 pF Including jig and scope
353
Figure 1.
Figure 2.
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Rev. B 09/22/06
7
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8 Symbol Parameter ICC VDD Dynamic Operating Supply Current Test Conditions VDD = Max., IOUT = 0 mA, f = fMAX VIN = 0.4V or VDD -0.3V VDD = Max., IOUT = 0 mA, f = 0 VIN = 0.4V or VDD -0.3V VDD = Max., VIN = VIH or VIL CE VIH, f = 0 VDD = Max., CE VDD - 0.2V, VIN VDD - 0.2V, or VIN 0.2V, f = 0 Com. Ind. Auto. typ.(2) Com. Ind. Auto. Com. Ind. Auto. Com. Ind. Auto. typ.(2) Min. -- -- -- -- -- -- -- -- -- -- -- -- Max. 110 115 -- 85 90 -- 30 35 -- 20 25 -- -10 Min. Max. -- -- -- 60 -- -- -- -- -- -- -- -- -- 4 85 90 110 30 35 70 20 25 60 -- -- -- -- -- -- -- -- -- 90 95 140
ISSI
-20 Min. Max. -- -- -- 50 60 100 45 55 90 30 35 70 20 25 60 Unit mA
(R)
ICC1
Operating Supply Current TTL Standby Current (TTL Inputs) CMOS Standby Current (CMOS Inputs)
mA
ISB1
mA
ISB2
mA
Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. 2. Typical values are measured at VDD = 3.0V, TA = 25oC and not 100% tested.
8
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Rev. B 09/22/06
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-8 Symbol Parameter Read Cycle Time Address Access Time Output Hold Time CE Access Time OE Access Time OE to High-Z Output OE to Low-Z Output CE to High-Z Output CE to Low-Z Output LB, UB Access Time LB, UB to High-Z Output LB, UB to Low-Z Output Power Up Time Power Down Time Min. 8 -- 2.5 -- -- -- 0 0 3 -- 0 0 0 -- Max. -- 8 -- 8 5.5 3 -- 3 -- 5.5 3 -- -- 8 -10 Min. Max. 10 -- 2.5 -- -- -- 0 0 3 -- 0 0 0 -- -- 10 -- 10 6.5 4 -- 4 -- 6.5 3 -- -- 10 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
ISSI
(R)
tRC tAA tOHA tACE tDOE tHZOE(2) tLZOE(2) tHZCE(2 tLZCE(2) tBA tHZB(2) tLZB(2) tPU tPD
Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage.
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9
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
ISSI
-20 ns Min. Max. 20 -- 2.5 -- -- 0 0 0 3 -- 0 0 -- 20 -- 20 8 8 -- 8 -- 8 8 -- Unit ns ns ns ns ns ns ns ns ns ns ns ns
(R)
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter Read Cycle Time Address Access Time Output Hold Time CE Access Time OE Access Time OE to High-Z Output OE to Low-Z Output CE to High-Z Output CE to Low-Z Output LB, UB Access Time LB, UB to High-Z Output LB, UB to Low-Z Output
(2)
tRC tAA tOHA tACE tDOE tHZOE(2) tLZOE tHZCE tLZCE tBA tHZB tLZB
(2
(2)
Notes: 1. Test conditions assume signal transition times of 1.5 ns or less, timing reference levels of 1.25V, input pulse levels of 0.4V to VDD-0.3V and output loading specified in Figure 1a. 2. Tested with the load in Figure 1b. Transition is measured 500 mV from steady-state voltage. Not 100% tested. 3. Not 100% tested.
10
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Rev. B 09/22/06
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL)
ISSI
t RC
(R)
ADDRESS
t AA t OHA
DOUT
PREVIOUS DATA VALID
t OHA
DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3) (CE and OE Controlled)
t RC
ADDRESS
t AA
OE
t OHA
t DOE
CE
t HZOE
t LZOE t ACE t LZCE t HZCE
DATA VALID
CE_RD2.eps
DOUT
HIGH-Z
Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE = VIL. 3. Address is valid prior to or coincident with CE LOW transitions.
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Rev. B 09/22/06
11
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8 Symbol Parameter Write Cycle Time CE to Write End Address Setup Time to Write End Address Hold from Write End Address Setup Time LB, UB Valid to End of Write WE Pulse Width WE Pulse Width (OE = LOW) Data Setup to Write End Data Hold from Write End
(2)
ISSI
-10 Max. -- -- -- -- -- -- -- -- -- -- 3.5 -- Min. 10 8 8 0 0 8 8 10 6 0 -- 2 Max. -- -- -- -- -- -- -- -- -- -- 5 -- Unit ns ns ns ns ns ns ns ns ns ns ns ns Min. 8 6.5 6.5 0 0 6.5 6.5 8.0 5 0 -- 2
(R)
tWC tSCE tAW tHA tSA tPWB tPWE1 tPWE2 tSD tHD tHZWE tLZWE(2)
WE LOW to High-Z Output WE HIGH to Low-Z Output
Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100% tested. 3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. Shaded area product in development
12
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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
Symbol Parameter Write Cycle Time CE to Write End Address Setup Time to Write End Address Hold from Write End Address Setup Time LB, UB Valid to End of Write WE Pulse Width (OE = HIGH) WE Pulse Width (OE = LOW) Data Setup to Write End Data Hold from Write End WE LOW to High-Z Output WE HIGH to Low-Z Output -20 ns Min. Max. 20 12 12 0 0 12 12 17 9 0 -- 3 -- -- -- -- -- -- -- -- -- -- 9 -- Unit ns ns ns ns ns ns ns ns ns ns ns ns
ISSI
(R)
tWC tSCE tAW tHA tSA tPWB tPWE1 tPWE2 tSD tHD tHZWE(3) tLZWE(3)
Notes: 1. Test conditions for IS61WV6416LL assume signal transition times of 1.5ns or less, timing reference levels of 1.25V, input pulse levels of 0.4V to VDD-0.3V and output loading specified in Figure 1a. 2. Tested with the load in Figure 1b. Transition is measured 500 mV from steady-state voltage. Not 100% tested. 3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
AC WAVEFORMS WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
ISSI
t WC
(R)
ADDRESS
VALID ADDRESS
t SA
CE
t SCE
t HA
WE
t AW t PWE1 t PWE2 t HZWE t LZWE
HIGH-Z
DOUT
DATA UNDEFINED
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
14
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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
AC WAVEFORMS WRITE CYCLE NO. 2 (WE Controlled. OE is HIGH During Write Cycle) (1,2)
t WC
ADDRESS
VALID ADDRESS
ISSI
(R)
t HA
OE
CE
LOW
t AW t PWE1
WE
t SA
UB, LB
t PBW
t HZWE
DOUT
DATA UNDEFINED
HIGH-Z
t LZWE
t SD
DIN
t HD
DATAIN VALID
UB_CEWR2.eps
WRITE CYCLE NO. 3 (WE Controlled. OE is LOW During Write Cycle) (1)
t WC
ADDRESS OE CE
VALID ADDRESS
LOW
t HA
LOW
t AW t PWE2
WE
t SA
UB, LB
t PBW
t HZWE
DOUT
DATA UNDEFINED
HIGH-Z
t LZWE
t SD
DIN
t HD
DATAIN VALID
UB_CEWR3.eps
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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
AC WAVEFORMS WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) (1,3)
t WC
ADDRESS
ADDRESS 1
ISSI
t WC
ADDRESS 2
(R)
OE
t SA
CE
LOW
WE
t HA t SA t PBW t PBW
WORD 2
t HA
UB, LB
WORD 1
t HZWE
DOUT
HIGH-Z
t LZWE t HD
DATAIN VALID
DATA UNDEFINED
t SD
DIN
t SD
DATAIN VALID
t HD
UB_CEWR4.eps
Notes: 1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be in valid states to initiate a Write, but any can be deasserted to terminate the Write. The tSA, t HA, tSD, and tHD timing is referenced to the rising or falling edge of the signal that terminates the Write. 2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state. 3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function.
16
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IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol Parameter VDD for Data Retention Data Retention Current Data Retention Setup Time Recovery Time Test Condition See Data Retention Waveform VDD = 1.2V, CE VDD - 0.2V See Data Retention Waveform See Data Retention Waveform Ind. Auto. Min. 1.2 -- -- 0 Max. 3.6 20 50 -- --
ISSI
Unit V mA ns ns
(R)
VDR
IDR
tSDR tRDR
tRC
DATA RETENTION WAVEFORM (CE Controlled)
tSDR VDD 1.65V Data Retention Mode tRDR
1.4V
VDR CE VDD - 0.2V
CE GND
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17
IS61WV102416ALL IS61WV102416BLL IS64WV102416BLL
ORDERING INFORMATION Industrial Range: -40C to +85C Voltage Range: 2.4V to 3.6V
Speed (ns) 10 (8 )
1
ISSI
(R)
Order Part No. IS61WV102416BLL-10MI IS61WV102416BLL-10MLI IS61WV102416BLL-10TI IS61WV102416BLL-10TLI
Package 48 mini BGA (9mm x 11mm) 48 mini BGA (9mm x 11mm), Lead-free TSOP (Type I) TSOP (Type I), Lead-free
Note: 1. Speed = 8ns for VDD = 3.3V + 5%. Speed = 10ns for VDD = 2.4V - 3.6V
Industrial Range: -40C to +85C Voltage Range: 1.65V to 2.2V
Speed (ns) 20 Order Part No. IS61WV102416ALL-20MI IS61WV102416ALL-20TI Package 48 mini BGA (9mm x 11mm) TSOP (Type I)
Automotive Range: -40C to +125C Voltage Range: 2.4V to 3.6V
Speed (ns) 10 Order Part No. Package
IS64WV102416BLL-10MA3 48 mini BGA (9mm x 11mm) IS64WV102416BLL-10TA3 TSOP (Type I)
18
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Rev. B 09/22/06
PACKAGING INFORMATION
Mini Ball Grid Array Package Code: M (48-pin)
ISSI
Bottom View
b (48x)
(R)
Top View 1 2 3 4 56 6
5
4
3
2
1
A B C D D E F G H D1
e
A B C D E F G H
e E E1
A2 SEATING PLANE A1
A
Notes: 1. Controlling dimensions are in millimeters.
Copyright (c) 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com -- 1-800-379-4774
Rev. D 01/15/03
PACKAGING INFORMATION
Mini Ball Grid Array Package Code: M (48-pin)
ISSI
(R)
mBGA - 6mm x 8mm
MILLIMETERS Sym.
N0. Leads A A1 A2 D D1 E E1 e b -- 0.25 0.60
INCHES Min. Typ. Max.
Min. Typ. Max.
48 -- -- -- 5.60BSC 5.90 6.00 6.10 4.00BSC 0.80BSC 0.40 0.45 0.50 1.20 0.40 --
.-- 0.010 0.024
-- 0.047 -- 0.016 -- --
7.90 8.00 8.10
0.311 0.314 0.319 0.220BSC 0.232 0.236 0.240 0.157BSC 0.031BSC 0.016 0.018 0.020
mBGA - 7.2mm x 8.7mm
MILLIMETERS Sym.
N0. Leads A A1 A2 D D1 E E1 e b -- 0 .24 0.60
mBGA - 9mm x 11mm
INCHES Min. Typ. Max. Sym.
N0. Leads
MILLIMETERS Min. Typ. Max.
48 -- 0.24 0.60 -- -- -- 5.25BSC 8.90 9.00 9.10 3.75BSC 0.75BSC 0.30 0.35 0.40 1.20 0.30 -- --
INCHES Min. Typ. Max.
Min. Typ. Max.
48 -- -- -- 5.25BSC 7.10 7.20 7.30 3.75BSC 0.75BSC 0.30 0.35 0.40 1.20 0.30 --
-- 0.009 0.024
-- -- --
0.047 0.012 --
A A1 A2 D D1 E E1 e b
-- -- --
0.047 0.012 --
0.009 0.024
8.60 8.70 8.80
0.339 0.343 0.346 0.207BSC 0.280 0.283 0.287 0.148BSC 0.030BSC 0.012 0.014 0.016
10.90 11.00 11.10
0.429 0.433 0.437 0.207BSC 0.350 0.354 0.358 0.148BSC 0.030BSC 0.012 0.014 0.016
2
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Rev. D 01/15/03
PACKAGING INFORMATION
Plastic TSOP - 48 pins Package Code: T (Type I)
A A1 1 N
ISSI
(R)
E
b
e D1
SEATING PLANE
D
L
C
Plastic TSOP (T - Type I) Millimeters Inches Symbol Min Max Min Max Ref. Std. N 48 A -- 1.20 -- 0.047 A1 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 19.8 20.2 0.780 0.795 D1 18.2 18.6 0.716 0.732 E 11.8 12.2 0.464 0.480 e 0.50 BSC 0.020 BSC L 0.50 0.70 0.020 0.028 0 5 0 5
Notes: 1. Controlling dimension: millimeters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D1 and E do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within 0.004 inches at the seating plane.
Integrated Silicon Solution, Inc.
PK13197T48 Rev. B 07/17/97

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